Head of Research and Development (Wide-Bandgap Semiconductor Packaging)

Join Carsem, a global leader in semiconductor packaging, as the Head of Research and Development to spearhead our cutting-edge initiatives in wide-bandgap (SiC/GaN) power semiconductor packaging. Based in the dynamic hub of Badung, Bali, you'll be at the forefront of innovation, driving our mission to deliver high-performance, reliable, and cost-effective semiconductor solutions. In this role, you'll lead a team of talented engineers and researchers, working closely with our global partners to develop and commercialize advanced packaging technologies for SiC and GaN power devices.

As the Head of Research and Development, you'll be responsible for overseeing all aspects of R&D activities, from concept development to product launch. You'll work with cutting-edge tools and software, including Ansys, COMSOL, and Cadence, to simulate and optimize our packaging designs. You'll also collaborate with our manufacturing teams to ensure our products meet the highest standards of quality and reliability.

This is an exciting opportunity to make a significant impact in the semiconductor industry. If you're passionate about innovation and have a proven track record in R&D, we encourage you to apply.

📋 Tanggung Jawab Pekerjaan

• Lead and manage the R&D team, ensuring the successful execution of all research and development projects.
• Develop and implement strategies to enhance the performance and reliability of wide-bandgap semiconductor packaging.
• Collaborate with global partners to identify and pursue new opportunities in the semiconductor market.
• Oversee the development and commercialization of new packaging technologies for SiC and GaN power devices.
• Work with Ansys, COMSOL, and Cadence to simulate and optimize packaging designs.
• Ensure all products meet the highest standards of quality and reliability.
• Foster a culture of innovation and continuous improvement within the R&D team.
• Represent Carsem at industry conferences and events to showcase our latest advancements in semiconductor packaging.

🎓 Kualifikasi & Syarat

• Bachelor's degree in Electrical Engineering, Materials Science, or a related field.
• 15+ years of experience in semiconductor packaging, with a focus on wide-bandgap materials.
• Proven track record in leading R&D teams and managing complex projects.
• Strong understanding of SiC and GaN power devices and their packaging requirements.
• Proficiency in Ansys, COMSOL, and Cadence.
• Excellent communication and leadership skills.
• Ability to work in a fast-paced, dynamic environment.
• Experience in managing global partnerships and collaborations.

🛠️ Keahlian

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